How to Achieve Precise Trace Impedance Control Through PCB Design
Learn how to control PCB trace impedance through stackup design, microstrip/stripline structures, differential routing, and simulation to ensure high-speed signal integrity.
PCB 4-Layer Board Design Guide: Optimal Stack-Up, Via Structures, and Routing Rules
A complete guide to PCB 4-layer board design, covering stack-up selection, via types, parasitic effects, and routing principles to ensure signal integrity and EMC performance.
Comprehensive PCB EMC Design Guide: Layout, Routing and Process Rules
A complete PCB EMC design guide covering component placement, routing, grounding, power noise control, clock layout, and process selection to reduce EMI issues.
Comprehensive Guide to PCB Thermal Design
PCB Thermal Design Guide — practical advice on component placement, thermal vias, copper pours, and thermal resistance analysis to improve reliability and performance.
PCB Stackup Design: Layering Principles and Applications for RF/High-Speed Circuits
Designing a PCB stackup is often considered optional because PCB manufacturers can assist with stackup creation. However, the stackup is directly related to signal integrity, EMI performance, and product reliability. This makes PCB Stackup Design an essential skill for any hardware engineer. Understanding stackup principles helps you select a structure that fits manufacturing constraints while […]
RF PCB design Tips and Layout Strategies
RF (Radio Frequency) circuits exhibit distributed parameter characteristics, making them sensitive to skin effects, coupling, ground noise, and layout constraints during actual operation. As a result, PCB designers often encounter EMI issues such as interference between digital and analog domains, power noise, or grounding problems. Therefore, finding the right balance between layout, routing, grounding, and shielding is crucial to achieving a stable and reliable RF design.